Vinci Publications

Department of Materials Science and Engineering, Lehigh University

JOURNAL PUBLICATIONS

  1. E. M. Zielinski, R. P. Vinci, and J. C. Bravman, Effects of barrier layer and annealing on abnormal grain growth in copper thin films, J. Appl. Phys., 76 (8), 1994, p. 4516.
  2. R. P. Vinci, E. M. Zielinski, and J. C. Bravman, Thermal strain and stress in copper thin films, Thin Solid Films, 262, 1995, p. 142. (Invited)
  3. E. M. Zielinski, R. P. Vinci and J. C. Bravman, The influence of strain energy on abnormal grain growth in copper thin films, Appl. Phys. Lett., 67 (8), 1995, p. 1078.
  4. E.M. Zielinski, R.P. Vinci and J.C. Bravman, Effects of barrier layer and processing conditions on thin film Cu microstructure, J. Elec. Mater. 24 (10), 1995, p. 1485.
  5. W.-M. Kuschke, A. Kretschmann, R.-M. Keller, R.P. Vinci, C. Kaufmann, and E. Arzt, Textures of Thin Copper Films, J. Mater. Res., 13 (10), 1998, pp. 2962-8.
  6. T.C. Hufnagel, P. El-Deiry, and R.P. Vinci, Development of shear band structure during deformation of a Zr57Ti5Cu20Ni8Al10 bulk metallic glass, Scripta Mat. 43, 2000, pp. 1071-5.
  7. J. T. Bloking, S. Krishnaswami, H. Jain, M. Vlcek, and R. Vinci, Photoinduced Changes in the Surface Morphology of As50Se50 Chalcogenide Glass Films, Optical Materials, 17, 2001, pp. 453-458.
  8. D.-K. Kim, W.D. Nix, R.P. Vinci, M.D. Deal, J.D. Plummer, A study of the effect of grain boundary migration on hillock formation in Al thin films, J. Appl. Phys., 90 (2), 2001, pp. 781-788.
  9. R.P. Vinci, S.A. Forrest, J.C. Bravman, Effect of interface conditions on yield behavior of passivated copper thin films, J. Mater. Res., 17(7), 2002, pp. 1863-1870.R.R. Chromik, R.P. Vinci, S.L. Allen and M.R. Notis, Mechanical Properties of Pb-Free Solder and Sn-Based Intermetallics Measured by Nanoindentation , JOM, June 2003, pp. 66-69. (Invited)
  10. R.R. Chromik, R.P. Vinci, S.L. Allen and M.R. Notis, Nanoindentation Measurements on Cu-Sn and Ag-Sn Intermetallics Formed in Pb-Free Solder Joints, J. Mater. Res., 18 (9), 2003, p. 2251.
  11. S. Hyun, R. P. Vinci, K.P. Fahey, B.M. Clemens, Effect of grain structure on the onset of diffusion-controlled relaxation in Pt thin films, Appl. Phys. Lett., 83 (14), 2003, pp. 2769-71.
  12. S. Hyun, W.L. Brown, and R. P. Vinci, Thickness and temperature dependence of stress relaxation in nanoscale aluminum films, Appl. Phys. Lett., 83 (21), 2003, pp. 4411-13.
  13. J.M. Rickman and R.P. Vinci, A computational materials science course for undergraduate majors, JOM-e, 55 (12), 2003, online at http://www.tms.org/pubs/journals/JOM/0312/Rickman/Rickman-0312.html. (Invited)
  14. S.L. Allen, M.R. Notis, R.R. Chromik, R.P. Vinci, Microstructural evolution in lead-free solder alloys. Part I: Cast Sn-Ag-Cu eutectic, J. Mater. Res., 19, 2004, pp. 1417-1424.
  15. S.L. Allen, M.R. Notis, R.R. Chromik, R.P. Vinci, D.J. Lewis, R. Schaefer, Microstructural evolution in lead-free solder alloys. Part II: Directionally solidified eutectic Sn-Ag-Cu, Sn-Cu and Sn-Ag alloys, J. Mater. Res., 19, 2004, pp. 1425-1431.
  16. J. Zezotarsky, R.R. Chromik, R.P. Vinci, M.C. Messmer, R. Michels, and J.W. Larsen, Imaging and mechanical property measurements of kerogen via nanoindentation, Geochimica et Cosmochimica Acta 68, 2004, p. 4113.
  17. S. Hyun, O. Kraft, and R.P. Vinci, Mechanical behavior of Pt and Pt-Ru solid solution alloy thin films, Acta Mat., 52(14), 2004, pp 4199-4211.
  18. H. Park, H.M. Chan and R.P. Vinci, Patterning of Sapphire Substrates Via a Solid State Conversion Process, J. Mater. Res., 20, 2005, pp. 417-23.
  19. R.R. Chromik, D.-N. Wang, A. Shugar, L. Limata, M.R. Notis, and R.P. Vinci, Mechanical Properties of Intermetallic Compounds in the Au-Sn System, J. Mater. Res., 20 (8), 2005, pp. 2161-2172.
  20. S. Hyun, Tejpal K. Hooghan, W.L. Brown, and R.P. Vinci, Linear Viscoelasticity in Aluminum Thin Films, to appear in Appl. Phys. Lett., August 2005.
  21. W-Y Zhang, J. P. Labukas, S. Tatic-Lucic, L. Larson, T. Bannuru, R. P. Vinci, and G. S. Ferguson, Novel Room-Temperature First-Level Packaging Process for Microscale Devices, to appear in Sensors and Actuators A, 2005.

REVIEW PAPERS

  1. R.P. Vinci and J.C. Bravman, Mechanical testing of thin films, in Transducers '91, IEEE, 1991, p. 943. (Invited)
  2. R.P. Vinci and J.J. Vlassak, Mechanical Behavior of Thin Films, in Annu. Rev. Mater. Sci., 26, 1996, pp. 431-62. (Invited)
  3. R.P. Vinci, Thin Films: Texture Effects on Mechanical Properties, Encyclopedia of Materials: Science and Technology, Elsevier Press, 2001. (Invited)
  4. S.P. Baker, R.P. Vinci and T. Arias, Elastic and anelastic behavior of materials in small dimensions, MRS Bulletin, 27 (1) 2002, pp. 26-29.
  5. R. P. Vinci and S. P. Baker, Mechanical Properties in Small Dimensions, MRS Bulletin, 27 (1) 2002, pp. 12-13.

REVIEWED CONFERENCE PROCEEDINGS

  1. R. P. Vinci, T. N. Marieb, and J. C. Bravman, Non-Destructive Evaluation of Strains and Voiding in Passivated Copper Metallizations, Mater. Res. Soc. Proc., 308, 1993, p. 297.
  2. R. P. Vinci, J. C. Bravman, Stress in Copper Thin Films with Barrier Layers, Mater. Res. Soc. Proc., 308, 1993, p. 337.
  3. R. P. Vinci, E. M. Zielinski, and J. C. Bravman, Thermal stresses in passivated copper interconnects determined by x-ray analysis and finite element modeling, Mater. Res. Soc. Proc., 338, 1994, p. 289.
  4. E. M. Zielinski, R. P. Vinci, and J. C. Bravman, Microstructural characterization of copper thin films on metallic underlayers, Mater. Res. Soc. Proc., 338, 1994, p. 307.
  5. R-M. Keller, S. Bader, R. P. Vinci, and E. Arzt, Influence of a capping layer on the mechanical properties of Cu films, Mater. Res. Soc. Proc., 356, 1995, p. 453.
  6. E. M. Zielinski, R. P. Vinci, and J. C. Bravman, Measurement of the dependence of stress and strain on crystallographic orientation in Cu and Al thin films, Mater. Res. Soc. Proc., 356, 1995, p. 429.
  7. R. P. Vinci, E. M. Zielinski, and J. C. Bravman, Effect of copper film thickness on stress and strain in grains of different orientation, Mater. Res. Soc. Proc., 356, 1995, p. 459.
  8. R.-M. Keller, W.-M. Kuschke, A. Kretschmann, S. Bader, R.P. Vinci, and E. Arzt, Influence of film thickness and capping layer on the mechanical properties of copper films, Mater. Res. Soc. Proc., 391, 1995, p. 309.
  9. E. M. Zielinski, R. P. Vinci and J. C. Bravman, The effects of processing on the microstructure of copper thin films on tantalum barrier layers, Mater. Res. Soc. Proc., 391, 1995, p. 303.
  10. E. M. Zielinski, R. P. Vinci and J. C. Bravman, The influence of strain energy minimization on abnormal grain growth in copper thin films, Mater. Res. Soc. Proc., 391, 1995, p. 103.
  11. R. P. Vinci, T. P. Weihs, E. M. Zielinski, T. W. Barbee, Jr., and J. C. Bravman, A simple analysis of average mechanical behavior and strain energy density of misoriented grains in a textured film, Mater. Res. Soc. Proc., 391, 1995, p. 97.
  12. R.P. Vinci and J.C. Bravman, Finite Element Modeling of Grain Aspect Ratio and Strain Energy Density in a Textured Copper Thin Film, Mater. Res. Soc. Proc., 436, 1995, p. 411.
  13. L.C. Bassman, R.P. Vinci, B.P. Shieh, D.-K. Kim, J.P. McVittie, K.C. Saraswat, and M.D. Deal, Simulation of the Effect of Dielectric Air Gaps on Interconnect Reliability, Mater. Res. Soc. Proc., 473, 1997, pp. 323-328.
  14. G. Cornella, R.P. Vinci, R. Suryanarayanan, R.H. Dauskardt, and J.C. Bravman, Observations of Low Cycle Fatigue of Al Thin Films for MEMS Applications, Mater. Res. Soc. Proc., 518, 1999, pp. 81-88.
  15. P. Zhang, R.P. Vinci, and J.C. Bravman, An In-situ Stress Sensor for Vapor-phase Thin Film Deposition, Mater. Res. Soc. Proc., 546, 1999, pp. 45-50.
  16. M. Glazer, C. Frank, R.P. Vinci, G. McGall, J. Fidanza, J. Beecher, High Surface Area Substrates for DNA Arrays, Mater. Res. Soc. Proc., 576, 1999, pp. 371-376.
  17. R.P. Vinci, G. Cornella, J.C. Bravman, Anelastic Effects in Freestanding Al Thin Films, Proc. 5th International Workshop on Stress Induced Phenomena in Metallization, Stuttgart, Germany, June, 1999, pp. 240-8. (Invited)
  18. P.A. El-Deiry, R.P. Vinci, Nicholas Barbosa III and T.C. Hufnagel, In-situ Observations of Shear Band Development during Deformation of a Bulk Metallic Glass, Mater. Res. Soc. Proc., 644, 2001, pp. L10.2.1-L10.2.6.
  19. S. Hyun, O. Kraft, and R.P. Vinci, Solid solution alloy effects on microstructure and indentation hardness in Pt-Ru thin films, Mater. Res. Soc. Proc., 673, 2001, pp. P3.2.1-P3.2.6.
  20. P. A. El-Deiry and R. P. Vinci, Anelastic Behavior Of Pure Aluminum and Copper Micro-Wires, Mater. Res. Soc. Proc., 695, 2002, p. 159.
  21. N. Barbosa III, R. S. Ridley, Sr., C. H. Strate, R. S. Dwyer, T. Grebs, R. P. Vinci , Metal Adhesion to <100> Si Substrates with Varying Surface Conditions, Mater. Res. Soc. Proc., 695, 2002, L7.9.1.
  22. R.R. Chromik, T. Bannuru, and R.P. Vinci, Internal oxidation and mechanical properties of Pt-IrO2 thin films, Proc. Mater. Res. Soc. Symp., 2004, U8.13.1-6.
  23. N. Barbosa, P. El-Deiry, and R.P. Vinci, Monotonic testing and tension-tension fatigue testing of freestanding Al microtensile Beams, Proc. Mater. Res. Soc. Symp., 2004, U.11.39.1-6.
  24. S. Hyun, W.L. Brown, and R. P. Vinci, Stress relaxation in nanoscale aluminum films, Proc. SPIE, 5343, 2004, 154-162.
  25. R.R. Chromik, R.P. Vinci and M.R. Notis, “Application of the Nanoindentation Technique for Characterization of Intermetallics in Pb-Free Solder Joints”, Proceedings of IMAPS Optoelectronics Conference and Workshop, September 2004, Technical publication available at www.imaps.org.
  26. P. A. El-Deiry, N. Barbosa III, W. L. Brown, R. P. Vinci, “Effective Modulus and Stress Relaxation of Freestanding Aluminum Microtensile Beams”, submitted to Proc. Mater. Res. Soc., 2004.

BOOKS EDITED

JOURNALS EDITED

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Last updated: August 2, 2005