J. Nouss, J. Ferfolja, U. Mohar, U. Florjani, A. Nikonov, A.Voloshin, I. Emri, �The Effect of Processing Conditions on Time-dependent Mechanical Properties of Extruded LDPE.� Proceedings of the 2007 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, June 4-7, 2007, paper #379.
G.A. Arangio, V. Chopra, A. Voloshin and E. Salathe. �A biomechanical analysis of the effect of lateral column lengthening calcaneal osteotomy on the flat foot,�Clinical Biomechanics, 22(4), 472-477, 2007.
I. Emri, B. S. von Bernstorff and A. Voloshin, �A Simple Technique for Studying Shrinkage Dynamics of Fibers,� Experimental Mechanics, 46(6), 683-690, 2006.
L. Han, and A. Voloshin, �Reliability of Test Lands Targeting for Bed-of- Nails Style Test Fixture,� Chinese Journal of Mechanical Engineering, 19(1):151-155, 2006, ISSN:1000-9345.
L. Han, and A. Voloshin, �Reliability Analysis for Bed-of-nails Testing Fixture During Electrical Testing�, Chinese Journal of Scientific Instrument, 27(3), 224-236, 2006, ISSN:0254-3087.
G. Grossman, K. Wanninger, A. Voloshin, G. Oxfeld, and R.Martino, �Reliability and validity of goniometric turnout measurements compared with MRI and retroreflective markers.� 6th Annual Meeting of the International Association for Dance Medicine and Science, 2006.
A. Voloshin, �Bioengineering � A Natural Area for Multi-Disciplinary Education.� Proceedings of the Symposium on Multi-/Inter- Disciplinary Engineering Education, August 16-20, 2006, East China University of Science and Technology, Shanghai, China.
I. Emri, B. v. Bernstorff�, and A. Voloshin, �Effect of Heating on Fiber Shrinkage.� Proceedings of the 2006 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, June 4-7, 2006, paper #23, Saint Louis, MO.
A. Voloshin, �Optical methods in characterization of time-dependent materials.� 10th International Workshop on Advances in Experimental Mechanics, Portoroz, Slovenia, Aug. 7-13, 2005.
L. Han, and A. Voloshin, �Reliability Study for Test Lands Targeting during Electrical Testing�, The 7th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP�05), Shanghai, 46-52, June 2005.
L. Han, A. Voloshin, and R. Pearson, �Optical Measurements for Micro- and Opto-electronic Packages/Substrates�, The 7th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP�05), Shanghai, 385-389, June 2005.
R. Reichenberg, Y. and A. Voloshin,� Effect of multiple power cycles on the in-plane deformation of the thermoelectric cooler.� Proceedings of the 2005 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, June 7-9, 2005, paper #359, Portland, OR.
A. Voloshin, �Effect of thermal loading on the deformations of the optoelectronic package -
A moir� interferometry approach.� Proceedings of SPIE, Volume 5595, 428-438, International Symposium on Optics East, Philadelphia, 25-28 October 2004.
R. Reichenberg, Y. Berlinsky, A. Voloshin and V. Gupta, �Analysis of the in-plane deformation of the thermoelectric cooler due to power cycling.� Abstracts of the Optoelectronics Devise Packaging Workshop, Bethlehem, PA, Oct 11-14, 2004.
A. Voloshin, �Deformation of the Thermoelectric Cooler � a Moire Interferometry Study.� Proceedings of the Proceedings of the 9th International Workshop on Advances in Experimental Mechanics, I.Emri, R. Cvelbar, and A. Nikonov, eds., ISBN 961-90575-9-7, Bled, Slovenia, Aug. 8-14, 2004.
L. Han, J. Zhong, and A. Voloshin, �Image Analysis and Data Processing of Time Series Fringe Pattern of PCBs by Using Moire Interferometry�, The 6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP�04), July 30 � July 3, 2004, pp: 141-145 ISBN: 0-7803-8620-5
R. Reichenberg, A. Bar, and A. Voloshin, �Deformation Measurements of the Optoelectronic Packages.� Proceedings of the 2004 SEM X International Congress on Experimental Mechanics, June 7-10, 2004, paper #393, Costa Mesa, CA.
L. Han and A. Voloshin. �Statistical Analysis for Test Lands Positioning and PCB Deformation During Electrical Testing," Microelectronics Reliability, 44(5), 853-859, May 2004.
L. Han, A. Voloshin and I. Emri. �Study of the Multilayer PCB CTEs by Moir� Interferometry,� Optics & Lasers in Engineering, 42(6), 613-626. 2004.
W. Kim, A. S. Voloshin, and J. Tan, �Foot-Surface Cushioning Mechanism during Stance Phase of Running.� Proceeding of the International Congress on Sport Dynamics (ICSD2003), Sept. 1-3, 2003, Melbourne, Australia, �Sports Dynamics, Discovery and Application,� Edited by A. Subic, P. Trvailo, and F. Alam, RMIT University, Melbourne, Australia, 2003.
L. Han, A. Voloshin and I. Emri, �CTE Measurements of the PCB at Low Temperatures.� Proceedings of the 2003 SEM Spring Conference on Experimental Mechanics, June 2-4, 2003, paper # 250, Charlotte, NC.
T. Prodan, I. Emri, B. S. von Bernstorff, and A. Voloshin, �The Effect of Temperature on Morphology and Mechanical Behavior of PA.� Proceedings of the 2003 SEM Spring Conference on Experimental Mechanics, June 2-4, 2003, paper # 251, Charlotte, NC.
P.C. Hung and A.S. Voloshin. �In-Plane Strain Measurement by Digital Image Correlation,� Journal of the Brazilian Society of Mechanical Sciences and Engineering, XXV(3), 215-221, 2003.