Publications
Recent Book Chapters
P. F. Joseph, H. F. Nied, and A. C. Kaya, Problems in Mechanics and Applied Mathematics - A Collection of Papers by Fazil Erdogan, compiled on the occasion of the symposium, Problems in Mechanics and Applied Mathematics, Lehigh University, June 28 - 30. 1998.
Recent Journal Publications
Bekisli, B., Pancrace, J., and Nied, H. F., "Mechanical Behavior of Highly-Flexible Elastomeric Composites with Knitted-Fabric Reinforcement," Key Engineering Materials, Vols. 404-506, pp. 1123-1128, 2012.
Bekisli, B., and Nied, H. F., "Thermoforming of Knitted Composite Structures: FEM Simulation and Experiments," Int. J. of Material Forming, Vol. 3, Suppl 1, pp. 615 – 618, 2010.
Ozkan, U., Nied, H. F., and Kaya, A. C., "Fracture Analysis of Cracks in Anisotropic Materials Using Enriched Finite Elements," Engineering Fracture Mechanics, Vol. 77, No. 7, pp. 1191 – 1202, 2010.
Joshi, S., Semetay, C., Price, J. W. H., and Nied, H. F., “Weld-Induced Residual Stresses in a Prototype Dragline Cluster and Comparison with Design Codes,” Thin-Walled Structures, 2009.
Citirik, E., Ozkan, U., and Nied, H. F., “Three-Dimensional Fracture Analysis of I-beams with Fillet Welds,” Int. J. of Terraspace Science and Engineering, Vol. 1, pp. 85 – 93, 2009.
Price, J. W. H., Ziara-Paradowska, A., Joshi, S., Finlayson, T., Semetay, C., and Nied, H., “Comparison of Experimental and Theoretical Residual Stresses in Welds: The Issue of Gauge Volume,” Int. Journal of Mechanical Sciences, Vol. 50, pp. 513 – 521, 2008.
Ayhan, A. O., Kaya, A. C., and Nied, H. F., “Analysis of Three-Dimensional Interface Cracks Using Enriched Finite Elements,” Int. J. Fracture, Vol. 142, pp. 255 – 276, 2007.
Hummel, S. R., and Nied, H. F., A Procedure for Measuring Biaxial Viscoelastic Behavior of Thermoplastics, Experimental Mechanics, Vol. 44, No. 4, pp. 381 386, August 2004.
Yildirim, B., and Nied, H. F., Residual Stresses and Distortion in Boiler Tube Panels with Welded Overlay Cladding, ASME Journal of Pressure Vessel Technology, Vol. 126, pp. 426 431, November 2004.
Heffes, M. J., and Nied, H. F., Analysis of Interfacial Cracking in Flip Chip Packages with Viscoplastic Solder Deformation, ASME Journal of Electronic Packaging, Vol. 126, No. 1, pp. 135 141, 2004.
Nied, H. F., Mechanics of Interface Fracture With Applications in Electronic Packaging, Invited Paper, IEEE Transactions on Device and Materials Reliability, Vol. 3, No. 4, pp. 129 143, 2003.
Ayhan, A. O., and Nied, H. F., Stress Intensity Factors for Three-Dimensional Surface Cracks using Enriched Finite Elements, International Journal for Numerical Methods in Engineering, Vol. 54, Issue 6, pp. 899 921, 2002.
Park, J., Harlow, D. G., and Nied, H. F., "Growth Kinetics of Interfacial Damage: Epoxy Coating on a Generic Dual Inline Package," IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 3, pp. 482 - 492, 2001.
DiGiovanni, A. A., Chan, H. M., Harmer, M. P., and Nied H. F., "Micromechanics of Deformation in Porous Liquid-Phase-Sintered Alumina under Hertzian Contact," Journal of the American Ceramic Society, 84, [8], pp. 1844 - 1850, 2001.
Ha, H.-C., Chan, H. M., and Nied, H. F., Hertzian Contact Behavior of Alumina-Based Trilayer Composites: Experimental Observation and FEM Analysis, Acta Materialia, 49, pp. 2453- 2461, 2001.
Park, J., Harlow, D. G., and Nied, H. F., Characterization of Interfacial Adhesion Damage Induced by Accelerated Life Testing, IEEE Transactions on Advanced Packaging, Vol. 23, No. 1, pp. 100 107, February 2000.
Bayram, Y. B., and Nied, H. F., Enriched Finite Element Penalty Function Method for Modeling Interface Cracks with Contact, Engineering Fracture Mechanics, Vol. 65, No. 5, pp. 541 - 557, 2000.
Xu, A. Q., and Nied, H. F., "Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages," ASME Journal of Electronic Packaging, Vol. 122, pp. 301 - 305, 2000.
DiGiovanni, A. A., Chan, H. M., Harmer, M. P., and Nied, H. F., Synergistic Effects of Porosity and Glass on Quasi-Ductility under Hertzian Contact in Liquid-Phase-Sintered Alumina, Journal of the American Ceramic Society, 82 (3), pp. 749 752, 1999.
Ayhan, A. O., and Nied, H. F., Finite Element Analysis of Interface Cracking in Semiconductor Packages, IEEE Transactions on Components and Packaging Technology, Vol. 22, No. 4, pp. 503 511, 1999.
Wang, C.-H., and Nied, H. F., "Temperature Optimization for Improved Thickness Control in Thermoforming," Journal of Materials Processing & Manufacturing Science, Vol. 8, No. 2, pp. 113 - 126, October 1999.
Recent Published Conference Proceedings
Bekisli, B., Pancrace, J., and Nied, H. F., "Mechanical Behavior of Highly-Flexible Elastomeric Composites with Knitted-Fabric Reinforcement," Proceedings of 15th ESAFORM Conference, Part 2, Erlangen, Germany, March 14-16, Edited by M. Merklein and H. Hagenah, pp. 1123-1128, 2012.
Bekisli B., and Nied, H.F., "Flexible Composites with Knitted Reinforcements," SPE Annual Technical Conference, ANTEC, Proceeding No: PENG-11-2010-0460, Boston, MA, May 2011.
Nied, H. F., and Bekisli, B., "Knitted-Fabric Reinforced Flexible Composites for Energy Absorption and Forming Applications," Proceedings of NSF CMMI Research and Innovation Conference 2011, Engineering for Sustainability and Prosperity, Atlanta, GA, CD-ROM, NSF Grant #0856611, 7 pages, January 4-7, 2011.
Bekisli, B., and Nied, H. F., "Mechanical Properties of Knitted-Fabric Reinforced Elastomeric Composites," Proceedings of the Polymer Processing Society 26th Annual Meeting, PPS-26, Banff (Canada), 8 pgs., 2010.
Bekisli, B., and Nied, H. F., "Thermoforming of Knitted Composite Structures: FEM Simulation and Experiments," Proceedings of The 13th International Conference on Material Forming, ESAFORM 2010, Brescia, Italy, April 7 – 9, CD-ROM, E. Cretti and C. Giardini, eds., Springer, Paper Number. MS10-320, 4 pgs., 2010.
Nied, H. F., “Mechanical Properties of Thermoformed Structures with Knitted Reinforcement,” 3rd Conference on Rotomoulding, Thermoforming and Stretch-Blow Moulding, Ecole des Mines d’Albi-Carmaux, pp. 71 – 72, March 2009.
C. Palego, S. Hadler, B. Baloglu, Z. Peng, J. C. Hwang, H. F. Nied, D. I. Forehand, C. L. Goldsmith, “Microwave Intermodulation Technique for Monitoring the Mechanical Stress in RF MEMS Capacitive Switches”, 2008 IEEE International Microwave Symposium, Atlanta, USA, June 2008.
Ozkan, U., and Nied, H. F., “Finite Element Based Three-Dimensional Crack Propagation Simulation on Interfaces in Electronic Packages,” IEEE Proceedings of 58th Electronic Components and Technology Conference, Lake Buena Vista, FL, pp. 1606 – 1613, May 27 – 30, 2008.
An, Y., Semetay, C., and Nied, H. F., “Laser Welding of Lightweight Structures: Finite Element Modeling of a Thin Aluminum Plate,” Proceedings of International Conference on Health Monitoring of Structure, Material and Environment, HMSME2007, Southeast University, Nanjing, China, pp. 839 – 842, Oct. 16 – 18, 2007.
Semetay, C., Mahmoud, H., and Nied, H. F., “Stress and Fracture Analysis for Welded Plate Girders in Bridge Structures,” Keynote Paper, Proceedings of International Conference on Health Monitoring of Structure, Material and Environment, HMSME2007, Southeast University, Nanjing, China, pp. 158 – 162, Oct. 16 – 18, 2007.
Joshi, S., Semetay, C., Price, JWH, and Nied, H., “Numerical Simulation of Welding Induced Residual Stresses in a Circular Hollow Section T-Joint,” Proceedings of ASME IMEC&E, Chicago, Nov. 5-10, 2006.
Ozkan, U., Kaya, A. C., Loghin, A., Ayhan, A. O., and Nied, H. F., “Fracture Analysis of Cracks in Anisotropic Materials Using 3DFAS and ANSYS,” Proceedings of ASME IMECE2006, Chicago, Illinois, Nov. 5-10, 2006.
Joshi, S., Semetay, C., Price, J.W.H., and Nied H. F., “Numerical Simulation of Welding Induced Residual Stresses in a CHS T-Joint,” SIF2006, International Conference and Exhibition on Structural Integrity and Failure, Sydney, Australia, Sept. 27 – 29, 2006.
Semetay, C., Dupont, J. N., and Nied, H. F., “Repair of Single Crystal Turbine Blades by the Laser Engineered Net Shaping Process: Preliminary Heat Transfer and Fluid Flow Modeling of the Melt Pool,” Proceedings of 2006 NSF Design, Service and Manufacturing Grantees and Research Conference, St. Louis, MO, CD-ROM, Grant #0500254, 3 pgs., July 24-27, 2006.
Saribay, M., and Nied, H. F., “Computation of Dynamic Stress Intensity Factors Using Enriched Finite Elements,” Fracture of Nano and Engineering Materials and Structures, Proceedings of the 16th European Conference of Fracture, E. E. Gdoutos, ed., Alexandroupolis, Greece, July 3-7, Springer, Netherlands, ISBN-13 978-1-4020-4971-2 pp. 395-396, and ISBN 1-4020-4971-4, CD ROM, 676_nie.pdf, 9 pgs., 2006.
Nied, H. F., Mengel, A., and Semetay, C., “Simulation of Laser Welding and LENS Fabrication Processes,” The 9th International Conference on Material Forming ESAFORM 2006, Glasgow, UK, N. Juster and A. Rosochowski, eds., April 26-28, ISBN 83-89541-11-1, pp. 527-530, 2006.
Herr, A. F., and Nied, H. F., Numerical Simulation of 3-D Mixed-Mode Crack Propagation on Bimaterial Interfaces, Proceeding of ICF11, 11th International Conference on Fracture, Turin, Italy, CD-ROM, No. 5115, March 20-25, 2005.
Nied, H. F., Numerical Simulation of 3-D Mixed-Mode Crack Propagation on Bimaterial Interfaces, FM2005, East China University of Science and Technology Press, ISBN 7-5628-1804-5, pp. 241 248, 2005.
Coulter, J. P., Nied, H. F., Smith, C. R., Angstadt, D. C., Cirucci, L., and Santoro, J., Involving Middle School Students in Customer Focused Undergraduate Manufacturing Education, Proceedings of the 2003 American Society for Engineering Education Annual Conference & Exposition, Nashville, TN, June 22 25, 2003.
Heffes, M. J., and Nied, H. F., Analysis of Interfacial Cracking in Flip Chip Packages with Viscoplastic Solder Deformation, IPACK2003-35346, Proceedings of the 2003 International Electronic Packaging Technical Conference and Exhibition, InterPACK 03, Maui, Hawaii, USA, ASME CD-ROM, ISBN 0-7918-3674-6, July 6 11, 2003.
Rungroungdouyboon, B., Coulter,, J. P., and Nied, H. F., A Numerical Simulation of Non-Homogenous Sheet Heating During Thermoforming Processes, JSME/ASME International Conference on Materials and Processing, Honolulu, HI, p. 385 390, October 15 18, 2002.
Nied, H. F., "Current Challenges for Improved Optimization and Control of Thermoforming Processes," Proceedings of the PPS-17, CD-ROM, file 374, The Polymer Processing Society, Seventeenth Annual Meeting, Montreal, Canada, pp. 1 - 17. May 21 - 24, 2001.
Ayhan, A. O., and Nied, H. F., Analysis of Three-Dimensional Interface Cracking in Electronic Packages, Advances in Fracture Research, Proceedings of ICF10, Editors: K. Ravi-Chandar, B. L. Karihaloo, T. Kishi, R. O. Ritchie, A. T. Yokobori Jr., T. Yokobori, ICF100832OR, Elsevier Science CD-ROM, ISBN 0080440428, December 2001.
Wang, C.-H., and Nied, H. F., "A Numerical Solution of the Inverse Problem for Thermoforming Processes Using Finite Element Analysis," CAE and Related Innovations for Polymer Processing, edited by Turng, L. S., Wang, H. P., Ramani, K., and Benard, A., , ASME publication MD-Vol. 90, pp. 245 - 256, 2000 ASME IMEC&E, Orlando, FL, November 5 -10, 2000.
Ayhan, A. O., and Nied, H. F., Finite Element Modeling of Crack Interactions with Solder Balls, Proceedings of SEM IX International Congress on Experimental Mechanics, pp. 889 - 894, Orlando, FL, June 5 8, 2000.
Wang, C. H., and Nied, H. F., Solution of Inverse Thermoforming Problems Using Finite Element Simulation, ANTEC 2000 Proceedings of the 58th Annual Technical Conference & Exhibition, Vol. XLVI, Orlando, Fl., pp. 768 - 772, Society of Plastics Engineers, May 7 - 11, 2000.
Pearson, R. A., Ayhan, A., and Nied, H. F., Modeling the Mechanical Behavior of Underfill Resins and Predicting Their Performance in Flip-Chip Assemblies, IMAPS International Symposium on Advanced Packaging Materials 2000, pp. 57 63, March 6 8, 2000.
Nied, H. F., and Wang, C.-H, Engineering Thermoplastics for Load Bearing Applications, Proceedings of the 2000 NSF Design & Manufacturing Grantees Conference, Vancouver, BC, January 3 - 6, 2000. CD ROM, University of Washington, Seattle, WA.
Pearson, R. A., Lloyd, T. B., and Nied, H. F., Fracture Behavior of Underfill Resins and Their Applications to Flip-Chip on Organic Substrate Assemblies, EEP-Vol 26-2, Advances in Electronic Packaging 1999 Volume 2, ASME, pp. 1749 1754, 1999.
Nied, H. F., Engineering Thermoplastics for Load Bearing Applications, 1999 NSF Design & Manufacturing Grantees Conference Proceedings, MPM-55, CD ROM, Long Beach, CA, January 5 8, 1999.
Wang, C.-H., and Nied, H. F., Numerical Analysis of Thermoforming Processes, Competing in a Global Manufacturing Environment, Proceedings 13th Conference with Industry, Lehigh University, pp. 31 43, May 24 25, 1999.
Recent Bulletins and Reports
Chen, Y., Liu, X., Saribay, M., and Nied, H. F., User-Defined Enriched Crack-Tip Elements for ANSYS, User Guide, Version 1.0, SRC Report, Sept. 2011.
Nied, H. F., “Calculation of Static Internal Pressure at Triaxial Yield for Thick Wall Tubing,” Draka Specialty Tubing, April 21, 2011.
Nied, H. F., “Assessment of Stresses and Elongation in Capillary Tubing,” Report for Pressure Tube Manufacturing, LLC, Final Report, July 2009.
Saribay, M., and Nied, H. F., “Shock Loading Analysis of Ceramic Support Bushings in Electrostatic Precipitators,” ERC Report, Prepared for Hamon Research-Cottrell, Inc. Air Pollution Control Division, May 2008.
Saribay, M., and Nied, H. F., “Insulator Cracking Problem,” ERC Progress Report, August 24, 2007.
Ozturk, M., and Nied, H. F., “Finite Element Thermal Stress Analysis of PP&L Montour Hanging Pendant Superheater,” PP&L Final Report, May 2007.
Citirik, E., and Nied, H. F., “3-D Fracture Analysis of Circumferentially Cracked Boiler Tubes, “PP&L Final Report, April 2007.
Baloglu, B., “Linear Elastic Analysis of a Switch Membrane,” DARPA Progress Report, April 2007.
Baloglu, B., and Nied, H. F., “Viscoelastic Analysis of a Switch Membrane,” DARPA Progress Report, March 2007.
Nied, H. F., “Stress and Fracture Analysis of OPT Buoy Column Failure,” Report prepared for Ocean Power Technologies, Inc., 25 pgs., August 17, 2006.
Dale, T., and Nied, H. F., “Poroelastic FEM Formulation for Modeling Porous Low-k Materials,” SRC Deliverable Report, Finite Element Fracture Mechanics Software for Multi-Scale Modeling of Electronic Structures, Task ID 1304.001, July 2006.
Ozkan, U., and Nied, H. F., “Report and Software for Fatigue Crack Propagation Simulation on Interconnect Interfaces,” SRC Deliverable Report, Finite Element Fracture Mechanics Software for Multi-Scale Modeling of Electronic Structures, Task ID 1304.001, May 2006.
Ozkan, U., Kaya, A. C., Loghin, A., Ayhan, A. O., and Nied, H. F., Fracture Analysis of Cracks in Anisotropic Materials Using 3DFAS and ANSYS, 2006GRC, Technical Information Series, Class 1 Report, January 2006.
Nied, H. F., Murugan, S., Ozturk, M., Nart, E., Mengel, A., Citirik, E., Finite Element Modeling of Residual Stresses and Distortion in Stainless Steel Welded Structures, Final Report, Project A-00.4, FY00, ONR Grant No. N00014-99-1-0887, Nonmagnetic Stainless Steel for Double Hull Ship Construction, ATLSS Report No. 04-06, Lehigh File No. 533610, March 31, 2004.
Nied, H. F., Analysis of Conical Springs for Electric Switching Applications, Lutron Electronics Company, September 2003.
Ozturk, M. and Nied, H. F., A Parametric Design Analysis of Solder Joint Reliability for Ball Grid Array Assemblies, Final Report, Visteon Technologies, May 2003.
Nied, H. F., Sensitivity Analysis of Models for Large Scale Welded Structures, ONR Stage 3 Progress Report, March 31, 2003.
Nied, H. F., and Sale, J. W., "Finite Element Analysis of Nozzle Outlet Stresses During Cold Start-Up of a High Pressure Steam Drum," ERC Report 01-400-06-06, March 2001.
Yildirim, B. and Nied, H. F., "Finite Element Simulation of Overlay Welding," ERC Report 00-500-05-20, August 2000.
Yildirim, B., and Nied, H. F., Finite Element Analysis of Montour Station Burner Tip Units, ERC Report, April 2000.
Nied, H. F., Annual Grant Progress Report, CAREER: Engineering Thermoplastics for Load Bearing Applications, March 2000.
Ayhan, A. O., and Nied, H. F., Finite Element Analysis of Socket Weld, Prepared for Duquesne Light, ERC Report 00-400-01-01, January, 2000.
Ayhan, A. O., and Nied, H. F., Finite Element Analysis U-Bolt Hanger Supports, Prepared for Duquesne Light, ERC Report 00-400-06-06, January, 2000.
Ayhan, A. O., and Nied, H. F., FRAC3D Finite Element Based Software for 3-D and Generalized Plane Strain Fracture Analysis (Second Revision), SRC Technical Report, October, 1999.