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Richard P. Vinci Publications

Journal Publications

  1. E. M. Zielinski, R. P. Vinci, and J. C. Bravman, Effects of barrier layer and annealing on abnormal grain growth in copper thin films, J. Appl. Phys., 76 (8), 1994, p. 4516.
  2. R. P. Vinci, E. M. Zielinski, and J. C. Bravman, Thermal strain and stress in copper thin films, Thin Solid Films, 262, 1995, p. 142. (Invited)
  3. E. M. Zielinski, R. P. Vinci and J. C. Bravman, The influence of strain energy on abnormal grain growth in copper thin films, Appl. Phys. Lett., 67 (8), 1995, p. 1078.
  4. E.M. Zielinski, R.P. Vinci and J.C. Bravman, Effects of barrier layer and processing conditions on thin film Cu microstructure, J. Elec. Mater. 24 (10), 1995, p. 1485.
  5. W.-M. Kuschke, A. Kretschmann, R.-M. Keller, R.P. Vinci, C. Kaufmann, and E. Arzt, Textures of Thin Copper Films, J. Mater. Res., 13 (10), 1998, pp. 2962-8.
  6. T.C. Hufnagel, P. El-Deiry, and R.P. Vinci, Development of shear band structure during deformation of a Zr57Ti5Cu20Ni8Al10 bulk metallic glass, Scripta Mat. 43, 2000, pp. 1071-5.
  7. J. T. Bloking, S. Krishnaswami, H. Jain, M. Vlcek, and R. Vinci, Photoinduced Changes in the Surface Morphology of As50Se50 Chalcogenide Glass Films, Optical Materials, 17, 2001, pp. 453-458.
  8. D.-K. Kim, W.D. Nix, R.P. Vinci, M.D. Deal, J.D. Plummer, A study of the effect of grain boundary migration on hillock formation in Al thin films, J. Appl. Phys., 90 (2), 2001, pp. 781-788.
  9. R.P. Vinci, S.A. Forrest, J.C. Bravman, Effect of interface conditions on yield behavior of passivated copper thin films, J. Mater. Res., 17(7), 2002, pp. 1863-1870.
  10. R.R. Chromik, R.P. Vinci, S.L. Allen and M.R. Notis, Mechanical Properties of Pb-Free Solder and Sn-Based Intermetallics Measured by Nanoindentation , JOM, June 2003, pp. 66-69. (Invited)
  11. R.R. Chromik, R.P. Vinci, S.L. Allen and M.R. Notis, Nanoindentation Measurements on Cu-Sn and Ag-Sn Intermetallics Formed in Pb-Free Solder Joints, J. Mater. Res., 18 (9), 2003, p. 2251.
  12. S. Hyun, R. P. Vinci, K.P. Fahey, B.M. Clemens, Effect of grain structure on the onset of diffusion-controlled relaxation in Pt thin films, Appl. Phys. Lett., 83 (14), 2003, pp. 2769-71.
  13. S. Hyun, W.L. Brown, and R. P. Vinci, Thickness and temperature dependence of stress relaxation in nanoscale aluminum films, Appl. Phys. Lett., 83 (21), 2003, pp. 4411-13.
  14. J.M. Rickman and R.P. Vinci, A computational materials science course for undergraduate majors, JOM-e, 55 (12), 2003, online at http://www.tms.org/pubs/journals/JOM/0312/Rickman/Rickman-0312.html. (Invited)
  15. S.L. Allen, M.R. Notis, R.R. Chromik, R.P. Vinci, Microstructural evolution in lead-free solder alloys. Part I: Cast Sn-Ag-Cu eutectic, J. Mater. Res., 19, 2004, pp. 1417-1424.
  16. S.L. Allen, M.R. Notis, R.R. Chromik, R.P. Vinci, D.J. Lewis, R. Schaefer, Microstructural evolution in lead-free solder alloys. Part II: Directionally solidified eutectic Sn-Ag-Cu, Sn-Cu and Sn-Ag alloys, J. Mater. Res., 19, 2004, pp. 1425-1431.
  17. J. Zezotarsky, R.R. Chromik, R.P. Vinci, M.C. Messmer, R. Michels, and J.W. Larsen, Imaging and mechanical property measurements of kerogen via nanoindentation, Geochimica et Cosmochimica Acta 68, 2004, p. 4113.
  18. S. Hyun, O. Kraft, and R.P. Vinci, Mechanical behavior of Pt and Pt-Ru solid solution alloy thin films, Acta Mat., 52(14), 2004, pp 4199-4211.
  19. H. Park, H.M. Chan and R.P. Vinci, Patterning of Sapphire Substrates Via a Solid State Conversion Process, J. Mater. Res., 20, 2005, pp. 417-23.
  20. R.R. Chromik, D.-N. Wang, A. Shugar, L. Limata, M.R. Notis, and R.P. Vinci, Mechanical Properties of Intermetallic Compounds in the Au-Sn System, J. Mater. Res., 20 (8), 2005, pp. 2161-2172.
  21. S. Hyun, Tejpal K. Hooghan, W.L. Brown, and R.P. Vinci, Linear Viscoelasticity in Aluminum Thin Films, Appl. Phys. Lett. 87, 2005, p. 061902.
  22. W-Y Zhang, J. P. Labukas, S. Tatic-Lucic, L. Larson, T. Bannuru, R. P. Vinci, and G. S. Ferguson, Novel Room-Temperature First-Level Packaging Process for Microscale Devices, Sensors and Actuators A, 123-124C, 2005, pp. 646-654.
  23. J.M. Biser, J.T. Perkins, H. Li, H.M. Chan, R.P. Vinci, Fabrication and morphological stability of aluminum nanostructures en route to nanopatterned sapphire, Advances in Science and Technology, 45, pp. 945-50, 2006.
  24. M.-T. Lin, P. El-Deiry, R.R. Chromik, N. Barbosa, W.L. Brown, T.J. Delph, and R.P. Vinci, Temperature-dependent microtensile testing of thin film materials for application to microelectromechanical systems, Microsyst. Technol. 12(10-11), 2006, pp. 1045-51.
  25. M.-T. Lin, R.R. Chromik, N. Barbosa III, P. El-Deiry, S. Hyun, W. L. Brown, R. P. Vinci, and T.J. Delph, The Influence of Vanadium Alloying on the Elevated-Temperature Mechanical Properties of Thin Gold Films, Thin Solid Films 515, 2007, 7919-25.
  26. N. Barbosa, R. Keller, D. Read, R. Geiss, and R.P. Vinci, Comparison of electrical and microtensile evaluation of mechanical properties of an aluminum film, Met Trans A 38(13), 2007, 2160-67.
  27. S. Dutta, H.M. Chan, and R.P. Vinci, Sub-surface Oxidation at the Aluminum-Sapphire Interface during Low Temperature Annealing, J Am Cer Soc 90(8), 2007, 2571-75.
  28. W. Wang, S. Tatic-Lucic, W.L. Brown, J. Iceman, S. Hyun, and R.P. Vinci, Precision in-package positioning with a thermal inchworm, Sensors and Actuators A 142(1), 2008, 316-321.
  29. W. Wang, S. Tatic-Lucic, W.L. Brown, and R.P. Vinci, Design of a bidirectional MEMS actuator with high displacement resolution, large driving force and power-free latching, Microelec Engin, 85(3), 2008, 587-598.
  30. H. Li, J. M. Biser, J. T. Perkins, S. Dutta, R. P. Vinci, and H. M. Chan, Thermal Stability of Cu Nanowires on a Sapphire Substrate, J Appl Phys 103(2), 2008, 024315-024323.
  31. T. Bannuru, S. Narksitipan, W. L. Brown, and R.P. Vinci, The electrical and mechanical properties of Au-V and Au-V2O5 thin films for wear-resistant RF MEMS switches, J Appl Phys 103(8), 2008, 083522-083527.
  32. D. A. Browne, H. Li, E. Giorgi, S. Dutta, J. M. Biser, R. P. Vinci, and H. M. Chan, Templated Epitaxial Coatings on Magnesium Aluminate Spinel using the Sol-Gel Method, J. Mater Sci, 44(5), 2009, 1180–1186.
  33. X. Yan, W.L. Brown, Y. Li, J. Papapolymerou, C. Palego, and R.P. Vinci, Anelastic Stress Relaxation in Gold Films and its Impact on Restoring Forces in MEMS Devices, JMEMS 18(3), 2009, 570 - 576.
  34. Y. K. Ee, J. Biser, W. Cao, H. M. Chan, R. P. Vinci, and N. Tansu, Metalorganic Vapor Phase Epitaxy of III-Nitride Light-Emitting Diodes on Nano-Patterned AGOG Sapphire Substrate by Abbreviated Growth Mode, IEEE J. Selected Topics in Quantum Electronics 15(4), 2009, 1066-1072.
  35. Y. K. Ee, X. H. Li, J. Biser, W. Cao, H. M. Chan, R. P. Vinci, and N. Tansu, Abbreviated MOVPE Nucleation Studies of III-Nitride Light-Emitting Diodes on Nano-Patterned Sapphire, J. Crystal Growth 312(8), 2010, 1311-1315.
  36. M. McLean, W.L. Brown, and R.P. Vinci, Temperature-Dependent Viscoelasticity in Thin Au Films and Consequences for MEMS Devices, JMEMS 19(6), 2010, 1299-1308.
  37. S. Dutta, T. B. Kim, T. Krentz, R. P. Vinci and H. M. Chan, Sol-gel Derived Single Crystal Alumina Coatings with Vermicular Structure, J. Am. Ceram. Soc. 94(2), 2011, 340-343.
  38. W. Cao, J. M. Biser, Y.-K. Ee, X.-H. Li, N. Tansu, H. M. Chan, and R. P. Vinci, Dislocation Structure of GaN Films Grown on Planar and Nano-Patterned Sapphire, J. Appl. Phys. 110(5), 2011, 053505 - 053505-4.

Review Papers

  1. R.P. Vinci and J.C. Bravman, Mechanical testing of thin films, in Transducers '91, IEEE, 1991, p. 943. (Invited)
  2. R.P. Vinci and J.J. Vlassak, Mechanical Behavior of Thin Films, in Annu. Rev. Mater. Sci., 26, 1996, pp. 431-62. (Invited)
  3. R.P. Vinci, Thin Films: Texture Effects on Mechanical Properties, Encyclopedia of Materials: Science and Technology, Elsevier Press, 2001. (Invited)
  4. S.P. Baker, R.P. Vinci and T. Arias, Elastic and anelastic behavior of materials in small dimensions, MRS Bulletin, 27 (1) 2002, pp. 26-29.
  5. R. P. Vinci and S. P. Baker, Mechanical Properties in Small Dimensions, MRS Bulletin, 27 (1) 2002, pp. 12-13.

Refereed Conference Proceedings

  1. R. P. Vinci, T. N. Marieb, and J. C. Bravman, Non-Destructive Evaluation of Strains and Voiding in Passivated Copper Metallizations, Mater. Res. Soc. Proc., 308, 1993, p. 297.
  2. R. P. Vinci, J. C. Bravman, Stress in Copper Thin Films with Barrier Layers, Mater. Res. Soc. Proc., 308, 1993, p. 337.
  3. R. P. Vinci, E. M. Zielinski, and J. C. Bravman, Thermal stresses in passivated copper interconnects determined by x-ray analysis and finite element modeling, Mater. Res. Soc. Proc., 338, 1994, p. 289.
  4. E. M. Zielinski, R. P. Vinci, and J. C. Bravman, Microstructural characterization of copper thin films on metallic underlayers, Mater. Res. Soc. Proc., 338, 1994, p. 307.
  5. R-M. Keller, S. Bader, R. P. Vinci, and E. Arzt, Influence of a capping layer on the mechanical properties of Cu films, Mater. Res. Soc. Proc., 356, 1995, p. 453.
  6. E. M. Zielinski, R. P. Vinci, and J. C. Bravman, Measurement of the dependence of stress and strain on crystallographic orientation in Cu and Al thin films, Mater. Res. Soc. Proc., 356, 1995, p. 429.
  7. R. P. Vinci, E. M. Zielinski, and J. C. Bravman, Effect of copper film thickness on stress and strain in grains of different orientation, Mater. Res. Soc. Proc., 356, 1995, p. 459.
  8. R.-M. Keller, W.-M. Kuschke, A. Kretschmann, S. Bader, R.P. Vinci, and E. Arzt, Influence of film thickness and capping layer on the mechanical properties of copper films, Mater. Res. Soc. Proc., 391, 1995, p. 309.
  9. E. M. Zielinski, R. P. Vinci and J. C. Bravman, The effects of processing on the microstructure of copper thin films on tantalum barrier layers, Mater. Res. Soc. Proc., 391, 1995, p. 303.
  10. E. M. Zielinski, R. P. Vinci and J. C. Bravman, The influence of strain energy minimization on abnormal grain growth in copper thin films, Mater. Res. Soc. Proc., 391, 1995, p. 103.
  11. R. P. Vinci, T. P. Weihs, E. M. Zielinski, T. W. Barbee, Jr., and J. C. Bravman, A simple analysis of average mechanical behavior and strain energy density of misoriented grains in a textured film, Mater. Res. Soc. Proc., 391, 1995, p. 97.
  12. R.P. Vinci and J.C. Bravman, Finite Element Modeling of Grain Aspect Ratio and Strain Energy Density in a Textured Copper Thin Film, Mater. Res. Soc. Proc., 436, 1995, p. 411.
  13. L.C. Bassman, R.P. Vinci, B.P. Shieh, D.-K. Kim, J.P. McVittie, K.C. Saraswat, and M.D. Deal, Simulation of the Effect of Dielectric Air Gaps on Interconnect Reliability, Mater. Res. Soc. Proc., 473, 1997, pp. 323-328.
  14. G. Cornella, R.P. Vinci, R. Suryanarayanan, R.H. Dauskardt, and J.C. Bravman, Observations of Low Cycle Fatigue of Al Thin Films for MEMS Applications, Mater. Res. Soc. Proc., 518, 1999, pp. 81-88.
  15. P. Zhang, R.P. Vinci, and J.C. Bravman, An In-situ Stress Sensor for Vapor-phase Thin Film Deposition, Mater. Res. Soc. Proc., 546, 1999, pp. 45-50.
  16. M. Glazer, C. Frank, R.P. Vinci, G. McGall, J. Fidanza, J. Beecher, High Surface Area Substrates for DNA Arrays, Mater. Res. Soc. Proc., 576, 1999, pp. 371-376.
  17. R.P. Vinci, G. Cornella, J.C. Bravman, Anelastic Effects in Freestanding Al Thin Films, Proc. 5th International Workshop on Stress Induced Phenomena in Metallization, Stuttgart, Germany, June, 1999, pp. 240-8. (Invited)
  18. P.A. El-Deiry, R.P. Vinci, Nicholas Barbosa III and T.C. Hufnagel, In-situ Observations of Shear Band Development during Deformation of a Bulk Metallic Glass, Mater. Res. Soc. Proc., 644, 2001, pp. L10.2.1-L10.2.6.
  19. S. Hyun, O. Kraft, and R.P. Vinci, Solid solution alloy effects on microstructure and indentation hardness in Pt-Ru thin films, Mater. Res. Soc. Proc., 673, 2001, pp. P3.2.1-P3.2.6.
  20. P. A. El-Deiry and R. P. Vinci, Anelastic Behavior Of Pure Aluminum and Copper Micro-Wires, Mater. Res. Soc. Proc., 695, 2002, p. 159.
  21. N. Barbosa III, R. S. Ridley, Sr., C. H. Strate, R. S. Dwyer, T. Grebs, R. P. Vinci , Metal Adhesion to <100> Si Substrates with Varying Surface Conditions, Mater. Res. Soc. Proc., 695, 2002, L7.9.1.
  22. R.R. Chromik, T. Bannuru, and R.P. Vinci, Internal oxidation and mechanical properties of Pt-IrO2 thin films, Proc. Mater. Res. Soc. Symp., 2004, U8.13.1-6.
  23. N. Barbosa, P. El-Deiry, and R.P. Vinci, Monotonic testing and tension-tension fatigue testing of freestanding Al microtensile Beams, Proc. Mater. Res. Soc. Symp., 2004, U.11.39.1-6.
  24. S. Hyun, W.L. Brown, and R. P. Vinci, Stress relaxation in nanoscale aluminum films, Proc. SPIE, 5343, 2004, 154-162.
  25. R.R. Chromik, R.P. Vinci and M.R. Notis, “Application of the Nanoindentation Technique for Characterization of Intermetallics in Pb-Free Solder Joints”, Proceedings of IMAPS Optoelectronics Conference and Workshop, September 2004, Technical publication available at www.imaps.org.
  26. P. A. El-Deiry, N. Barbosa III, W. L. Brown, R. P. Vinci, “Effective Modulus and Stress Relaxation of Freestanding Aluminum Microtensile Beams”, Proc. Mater. Res. Soc., 2004, p. U10.10.
  27. J.T. Iceman, R. A. Pearson, R.P. Vinci. And S. Tatic-Lucic, MEMS Fiber Optic Aligner: Characterization and Engineering, IMAPS Proceedings of the 2005 International Symposium on Microelectronics, 2005, pp. 291-299.
  28. T. Bannuru, S. Narksitipan, W. L. Brown, and R.P. Vinci, Effects of V additions on the mechanical behavior of Au thin films for MEMS contact switches, Proc. SPIE 6463, 2007, 646306.
  29. R.P. Vinci, T. Bannuru, S. Hyun, and W.L. Brown, Fabrication of Pt-IrOx and Au-V2O5 Thin Films, Key Engineering Materials 345-346, 2007, pp. 735-740.
  30. S. Hyun, W. L. Brown, and R.P. Vinci, A novel capacitance bulge apparatus and measurements of the mechanical properties of Al thin films using it, Key Engineering Materials 345-346, 2007, pp. 745-748.
  31. M.-T. Lin, R. Chromik, N. Barbosa III, P. El-Deiry, S. Hyun, W. Brown, R.P. Vinci, T.J. Delph, Microtensile testing of gold and gold-vanadium thin films at elevated temperatures, Proceedings of the Seventh International Congress on Thermal Stresses, v 1, Taipei, Taiwan, June 2007, pp. 325-328.
  32. Y. K. Ee, R. A. Arif, N. Tansu, H. Li, H. M. Chan, R. P. Vinci, P. Capek, N. K. Jha, and V. Dierolf, Improved Photoluminescence of InGaN Quantum Wells Grown on Nano-Patterned AGOG Sapphire Substrate by Metalorganic Vapor Phase Epitaxy, in Proc. of the 20th IEEE Laser and Electro-Optics Society (LEOS) Annual Meeting 2007, Lake Buena Vista, FL, October 2007, pp. 902-903.
  33. Y. K. Ee, J. Biser, W. Cao, H. M. Chan, R. P. Vinci, and N. Tansu, Growths of InGaN Quantum Wells Light-Emitting Diodes on Nano-Patterned AGOG Sapphire Substrate Using Abbreviated Growth Mode, in Proc. of the IEEE/OSA Conference on Lasers and Electro-Optics (CLEO) 2009, Baltimore, MD, May 2009.
  34. Y. K. Ee, X. H. Li, J. Biser, W. Cao, H. M. Chan, R. P. Vinci, and N. Tansu, Abbreviated GaN Metalorganic Vapor Phase Epitaxy Growth Mode on Nano-Patterned Sapphire for Enhanced Efficiency of InGaN-Based Light-Emitting Diodes, in Proc. of the SPIE Photonics West 2010, LEDs: Materials, Devices, and Applications for Solid State Lighting XIV, San Francisco, CA, Jan 2010.
  35. Y. K. Ee, X. H. Li, J. Biser, W. Cao, H. M. Chan, R. P. Vinci, and N. Tansu, Growth Evolution and Time-Resolved Measurements of III-Nitride Light-Emitting Diodes Grown by Abbreviated Growth Mode on Patterned AGOG Substrate, in Proc. of the IEEE/OSA Conference on Lasers and Electro-Optics (CLEO) 2010, San Jose, CA, May 2010.
  36. X. H. Li, S. Dutta, T. Krentz, T. B. Kim, R. P. Vinci, N. Tansu, and H. M. Chan, MOCVD GaN Growth on Vermicular Sol-Gel Derived Sapphire Coatings, in Proc. of 4th International Conference on Molecular
    Materials 2010 (MOLMAT 2010), Montpellier, France, July 2010.
  37. S. Dutta, T. Krentz, X. H. Li, T. B. Kim, R. P. Vinci, N. Tansu, and H. M. Chan, "Microstructural Evolution of Alumina Sol-gel Coatings on Sapphire," in Proc. of Materials Science & Technology 2010, Sol-Gel
    Fundamentals and Applications, Houston, TX, October 2010.

Books

  1. R.W. Hertzberg, R.P. Vinci, and J.L. Hertzberg, “Deformation and Fracture Mechanics of Engineering Materials”, 5th ed., John Wiley & Sons, 2012.

Edited Books

  1. “Thin Films — Stresses and Mechanical Properties VIII”, Eds. R.P. Vinci, O. Kraft, N. Moody, P. Besser, and E. Shaffer, Mater. Res. Soc., Vol. 594, 2000.

Invited Presentations

  1. Influence of interface conditions on mechanical properties of Cu thin films, Joint ASME, ASCE and SES Summer Meeting, Northwestern Univ., June 1997.
  2. Microelectromechanical Structures (MEMS) for Materials Research, Intel Corporation, April 1997.
  3. Low-Cycle Fatigue of Al Microbeams, ASME Annual Congress, Anaheim, CA, November 1998.
  4. Low Cycle Fatigue Testing of Al Microbeams for MEMS Applications, AlliedSignal, October 1998.
  5. Low Cycle Fatigue Testing of Al Microbeams for MEMS Applications, Johns Hopkins University, September 1998.
  6. Fatigue Behavior of Al Microbeams for MEMS Applications, Ringberg Symposium on Mechanics and Design of Small-Scale Materials and Systems, Tegernsee, Germany, June 1998.
  7. Evidence of Anelasticity in Freestanding Al Thin Films, NSF Nano and MicroMechanics Workshop, Palo Alto, California, October 1999.
  8. Thin Film Mechanical Behavior, Student Materials Society seminar, Bethlehem, Pennsylvania, October 1999.
  9. Anelastic Effects in Freestanding Al Thin Films, 5th International Workshop on Stress Induced Phenomena in Metallization, Stuttgart, Germany, June, 1999
  10. Thin Film Mechanical Behavior: Challenges and Opportunities, Bucknell University, Lewisburg, Pennsylvania, November 2000.
  11. Thin Film Mechanical Behavior: Challenges and Opportunities, Rowan University, Glassboro, New Jersey, October 2000.
  12. Anelastic Effects in Freestanding Al Thin Films, poster presentation at Gordon Conference on Thin Film Mechanical Behavior, Plymouth, New Hampshire, July, 2000.
  13. Anelastic Effects in Freestanding Al Thin Films, Cornell University, Ithaca, New York, April, 2000.
  14. Evidence of Anelasticity in Freestanding Al Thin Films, Sandia National Laboratory, Albequerque, New Mexico, February 2000.
  15. Pt thin films: Effects of thermal treatment and alloying, SUNY Binghamton, Binghamton, New York, December 2001.
  16. Pt thin films: Effects of thermal treatment and alloying, Materials Research Society Fall Symposium, Boston, Massachusetts, November 2001.
  17. Microtensile testing of freestanding Al thin films, ASME Congress, New York, New York, November 2001.
  18. Pt thin films: Effects of thermal treatment and alloying, ASME symposium on Low-k dielectrics/Copper interconnects, San Diego, California, June 2001.
  19. Pt thin films: Effects of thermal treatment and alloying, Johns Hopkins University, Baltimore, Maryland, April 2001.
  20. In-situ observations of shear bands in a Zr57Ti5Cu20Ni8Al10 bulk metallic glass alloy, co-presented with Dr. Todd Hufnagel, Johns Hopkins University, Baltimore, Maryland, April 2001.
  21. Pt thin films: Effects of thermal treatment and alloying, Harvard University, Cambridge, Massachusetts, April 2001.
  22. Microtensile testing of freestanding Al thin films, Materials Research Society Spring Symposium, San Francisco, California, April 2001.
  23. Anelastic Contributions to the Behavior of Freestanding Thin Films, Lucent/Agere Bell Laboratories, Murray Hill, New Jersey, February 2001.
  24. Effects of Microstructure and Solute Content on Mechanical Behavior of Pt Thin Films, Gordon Research Conference on Thin Film Mechanical Behavior, Colby College, ME, July 14-19, 2002.
  25. Effects of Microstructure and Solute Content on Indentation Behavior of Pt Thin Films, 14th US National Congress of Theoretical and Applied Mechanics, Virginia Tech, Blacksburg, VA, June 23-28, 2002.
  26. Investigation of the Mechanical Properties of Pb-Free Solders by Nanoindentation, SMTA International, Chicago, IL, September 26, 2002 (R.R. Chromik, speaker).
  27. Nanoindentation Studies at Lehigh University, Presentation to Hysitron, Inc., Minneapolis, MN, September 9, 2002 (R.R. Chromik, speaker).
  28. Mechanical behavior of thin metal films for MOEM applications, IMAPS meeting, Bethlehem, PA, February 21, 2002.
  29. Effects of Microstructure and Solute Content on Mechanical Behavior of Pt Thin Films, Rutgers University, February 11, 2003.
  30. Creep in nanometer thickness Al films, THERMEC, Madrid, Spain, July, 2003.
  31. Alloying effects on mechanical behavior of thin films, AVS Annual Meeting, Baltimore, MD, October, 2003.
  32. Creep in nanometer thickness Al films, ASME National Congress, Washington, DC, November, 2003.
  33. Mechanical behavior of nanometer scale thin films, TMS Annual Meeting, Charlotte, NC, March 2004.
  34. Effects of Alloying on Strength and Residual Stress of Pt-based Thin Films, Army Research Laboratory, Adelphi, MD, June, 2004.
  35. Mechanical Behavior of Thin Films and Small-Scale Structures, National Institute of Standards and Technology, Boulder, CO, April, 2005.
  36. Anelasticity in Fine-Grained Al Films, Workshop on ‘Fine Grained Materials: Challenges and Opportunities’, U. British Columbia, Vancouver (Canada), November, 2005.
  37. Stress and interface energy driven morphology changes in
    Al (and Cu) on Sapphire: Effects on blanket films and wires
    , Materials Research Society Fall Symposium, Boston, Massachusetts, November 2006.
  38. Fabrication of Pt-IrOx and Au-V2O5 Thin Films, ICM10, Busan, Korea, May 2007.
  39. The Effect of Vanadium Oxide Nanoparticles on Properties and Performance of Gold Thin Films, KIMM, Daejon, Korea, May 2007.
  40. The Effect of Vanadium Oxide Nanoparticles on Properties and Performance of Gold Thin Films, MS&T, Detroit, Michigan, September 2007.
  41. Electrical resistivity and mechanical strength of nanoparticle-reinforced gold films, Lafayette College, Easton, PA, March 2008.
  42. Electrical resistivity and mechanical strength of nanoparticle-reinforced gold films, Drexel University, Philadelphia, PA, April 2008.
  43. Mechanical behavior of thin films and small-scale structures (a 3-day short course), Rey Juan Carlos University, Mosteles, Spain, May 2008.
  44. Electrical and mechanical behavior of oxide-dispersion strengthened gold microcontacts, Rey Juan Carlos University, Mosteles, Spain, May 2008.
  45. Epitaxial Conversion of Surface Coatings on c-plane Sapphire and Magnesium Aluminate Spinel (Invited), Materials Science & Technology 2008, Pittsburgh, PA, October 2008 (H. M. Chan, speaker).
  46. Time-dependent deformation of thin gold and aluminum films, Materials Research Society Fall Symposium, Boston, Massachusetts, December 2008.
  47. Mechanical behavior of nanoparticle-reinforced metal thin films (Keynote Address), International Symposium on Plasticity 2009, St. Thomas, U.S. Virgin Islands, January 2009.
  48. Mechanical and electrical behavior of oxide-dispersion strengthened gold microcontacts, International Conference on Metallurgical Coatings and Thin Films (ICMCTF), San Diego, California, May 2009.
  49. Adventures in Undergraduate Research Using Instrumented Indentation, ASM International Young Members' Night Meeting, Bethlehem, PA, November 2009.
  50. Viscoelastic Behavior of Metal Thin Films, MS&T 2010, Houston, TX, October 2010.
  51. Viscoelastic Behavior of Metal Thin Films, Villanova University, November 2011.

(Last updated 02/2012)

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