Pre-Columbian Peruvian Metals

Sample 23

Ear Stud

Chimu/Inca

Peru

ca. 1100-1400 AD

Report by :

Timothy Anderson

May 14, 2003

Introduction
Figure 1: Ear stud
 
Sample 02-01-23 was also found in Peru. It has been dated to around 1100-1400 AD. This was a transitional period for the Peruvian region, as the Incan Empire was slowly taking over, replacing the Chimu. As such, the culture that formed it has not been concluded. It is believed to be the spool to an earring (Figure 1). The cap of the cylinder was likely bonded to larger ornamental jewelry pieces.
Proceedure  
Initial inspections were performed using x-ray images of the entire sample. A seam was visible running up the side of the cylinder. A portion of this seam and a cut portion of the soldered area between the cap and cylinder were chosen for analysis. A jeweler's saw was used to saw the individual pieces, taking great care for such a brittle piece. The two slivers were mounted in epoxy resin and prepared using sandpaper and diamond polish wheels (polished to 1/4 um). The specimens were observed under LOM. A radiomicrograph and EDS spectrums were taken of the jointed area between solder and base metal under the microprobe.
Figure 2: Solder bounded by base metal in cylinder seam sample. The metal plates are corroded but the original surface can be seen.
Figure 3: Break in base metal from excessive corrosion. Original size of the plate can be seen under the corrosion layers.
Results  
Under LOM, many phases were visible. The base metal had almost completely corroded (figures 2, 4), while much of the solder still remained (figures 2, 5). Lines were visible where the original surface of the metal had existed. Three phases were visible in the solder. EDS proved that the equi-axed grains were a silver-rich phase. Between these grains existed two copper-rich phases, with significant amounts of silver and arsenic (figures 6, 7).
Figure 4: Edge of corroded base metal. The light boundary line represents the original edge of the metal before corrosion. The internal banding is caused by preferential corrosion of one metal over another in the alloy.
Figure 5: Metal / Solder Interface. Note the three phases visible in the solder in the top half. The metal plate (lower area) is preferentially corroded.
Discussion  
The initial sampling of the earring spool was quite difficult. The corrosion present made it quite brittle, as it shattered multiple times underneath the force of the jeweler's saw. The most durable regions of the piece were the solders themselves, which made sampling of the joined material fairly simple.
The earring spool was an excellent example of soldering performed by the South American peoples. The shape of the sample indicated that they were well-versed in metal sheet-working, as the cylinder is quite thin, yet has been shaped into a near perfect circle. The seam of the cylinder and the cap were joined with the same soldering material, a copper-silver-arsenic alloy. Three different phases were found in the solder, each of varying composition. This alloy was probably used because copper and silver form a eutectic. Thus, the alloy would melt at a lower temperature than either pure metal.
Figure 6: Compositional map (taken in the EPMA) showing the enriched silver levels in the solder (bright areas).
Figure 7: Compositional map (taken in the EPMA) showing the enriched arsenic areas (brighter areas - intermixed with copper).
Untitled Document

____________________________________

This site was last updated on July 25 2003