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Nanofabrication



Micro / Nanofabrication Capabilities

Substrates:
(up to 150 mm) Semiconductor, Glass, Metal Foil, etc.

Lithography:
1) UV Optical 1:1 Projection (min. feature size 1 micron)
2) E-beam direct write (min feature size 20 nm)

Processing:
Sputtering, E-beam, PECVD, LPCVD, RTA, etc.


LEO 1550VP GEMINI E-beam System





Clean Room Facility for Prototype Fabrication

LPCVD

Lithography

PECVD

RIE

Sputtering

Substrates:
up to 150 mm Si, Glass, Metal, etc.




MEMS Research at Lehigh

Excellent possibilities for the collaboration and interdisciplinary research
Example: Collaborative work with Professor Gregory Ferguson from Chemistry Department
Applications of Self Assembled Monolayers (SAMs) for BioMEMS-growing cells in a controlled manner by directing their attachment with patterned SAMs deposited on substrate

The second example: MEMS packaging using the gold cold welding technique developed at Lehigh (the group of Professor Ferguson, Department of Chemistry)
Example: Collaborative work with Professor Gregory Ferguson from Chemistry Department
Applications of Self Assembled Monolayers (SAMs) for BioMEMS-growing cells in a controlled manner by directing their attachment with patterned SAMs deposited on substrate

 


MEMS Researchers
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