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Micro / Nanofabrication
Capabilities
Substrates:
(up to 150 mm) Semiconductor, Glass, Metal Foil, etc.
Lithography:
1) UV Optical 1:1 Projection (min. feature size 1 micron)
2) E-beam direct write (min feature size 20 nm)
Processing:
Sputtering, E-beam, PECVD, LPCVD, RTA, etc.
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LEO 1550VP GEMINI E-beam System
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Clean Room Facility
for Prototype Fabrication
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LPCVD

Lithography
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PECVD

RIE
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Sputtering

Substrates:
up to 150 mm Si, Glass, Metal, etc.
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 Excellent
possibilities for the collaboration and interdisciplinary
research
 Example:
Collaborative work with Professor Gregory Ferguson from
Chemistry Department
 Applications
of Self Assembled Monolayers (SAMs) for BioMEMS-growing
cells in a controlled manner by directing their attachment
with patterned SAMs deposited on substrate
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