Microelectronics Laboratory
Standard Operating Procedures
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Index
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| Safety |
Chemical handling, Right To Know law, process
safety, general toxicology and safety terms. |
| Oxidation |
Operational instructions for thermal oxidation. |
| CVD |
Operational instructions of chemical vapor deposition
of silicon, silicon dioxide and silicon nitride. |
| Diffusion |
Operational instructions for diffusion of phosphorus
using phosphorus oxichloride. |
| Photolithography |
Operational instructions for the application, exposure
and development of positive photoresist |
| Metal Evaporation |
Operational instruction for depositing aluminum
using a filament evaporator. Vacuum system
operation is also covered. |
| Sputtering |
Operational instructions of depositing aluminum
using a sputtering system. Vacuum system operation
is included. |
| Chemical Cleaning |
Instructions for a chemical cleaning of the wafer
surface. |
| Chemical Cleaning
Student Version 1 |
Student written version of chemical cleaning
instructions. |
| Chemical Cleaning
Student Version 2 |
Second version of student written chemical cleaning
instructions. |
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Instructions for annealing starting wafers to produce
defect gettering. |
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